Mr. Vamsi Boppana    
Mr. Vamsi Boppana
Site Director & CTO
Xilinx India

 

1. What part does India play in the overall product development strategy of Xilinx?

India is a major technology hub for Xilinx and plays an integral role in the research and development of a broad range of activities for the company including IC design, IP development, processing, software systems and application development. Our India R&D centre in Hyderabad is also critically involved in the development of Targeted Design Platforms, an approach adopted by Xilinx globally to address specific needs of our customers in different vertical markets. The centre is playing a key role in the development and delivery of the company’s flagship 28nm 7 series FPGA families.

In addition, Xilinx has partnered with leading Indian companies and has entered into multiple alliances with local universities.
 


2. Is Xilinx planning any investments in India?

Xilinx continues to significantly expand its R&D facility in India. Our Hyderabad facility has grown to 300 employees from 135 in 2009. The R&D Centre currently has the capacity to house 400 plus employees to work on a broad range of technologies ranging from IC design to applications development.


3. What new applications for FPGAs are you seeing in the foreseeable future?

In 2011 and beyond, a key growth driver for the electronics industry – and FPGAs – is an insatiable bandwidth demand from all corners of the globe. In 2014, annual global IP traffic is projected to exceed 3/4 of a zettabyte (1,000,000,000,000,000,000,000 bytes).

Such demand is altering the fabric of the semiconductor industry that has served the communications sector for more than two decades. In the face of today’s economic and market realities, traditional semiconductor business models are proving unsustainable. As a consequence, FPGAs are becoming the de facto standard for low-cost innovation in applications historically the stronghold of ASICs and ASSPs.

This phenomenon extends far beyond the traditional communications sector into a broad set of end markets and applications: automotive infotainment and driver safety, 3-D digital displays (handheld camcorders, TV, cinema projection), ultrasound imaging , high-definition video surveillance, robotic surgical instruments, even reconfigurable multi-processor computing in outer space, to name just a few.

In light of such demand for high-transistor and logic density to enable high levels of computational and bandwidth performance, Xilinx recently announced the launch of FPGAs using the innovative 3D packaging approach called Stacked Silicon Interconnect technology. An industry first, the 3D stacking approach enables Xilinx to overcome the boundaries of Moore’s Law and offer electronics manufacturers unparalleled power, bandwidth and density optimization for the large-scale-integration of their systems. The Virtex®-7 2000T device, the largest member of the Virtex-7 family offering two million logic cell capacity and thirty-six 10.3125Gbps transceivers, will have the first realization of the technology.

In November, we rolled out Virtex-7 HT FPGAs with demonstrated 28Gbps serial transceiver performance required for next generation 100-400Gbps applications. The 28nm FPGAs enable communication equipment vendors to develop the integrated, high-bandwidth-efficient systems necessary to keep pace with the exploding global demand for more bandwidth in the wired infrastructure and datacenters. The new devices are equipped with the industry's highest-speed and lowest jitter serial transceivers available in an FPGA to support stringent optical and backplane protocols.

Earlier this year, Xilinx also introduced a new ARM-based Extensible Processing Platform architecture for a completely new class of Xilinx product. This new 28nm platform represents a major breakthrough in extending our company’s reach beyond its traditional core FPGA business. The new embedded processing solution will appeal not only to traditional FPGA hardware designers but to embedded systems designers, offering a familiar ARM-based design methodology and ecosystem to decrease development time and speed time-to-market. It offers a combination of superior performance and high-processing horsepower and lower cost and power for emerging embedded systems applications in markets such as intelligent video, wireless communication, and automotive infotainment.

Xilinx will reveal product details for our 28nm Extensible Processing Platforms in the first half of 2011. Altogether, Xilinx’s expanded portfolio of 7 series 28nm programmable platforms will enable dramatic breakthroughs for a wide variety of applications.

Looking ahead, the future is bright for Xilinx and our industry, as the trend toward programmability accelerates. IC Insights predicted the PLD market would grow by 45 percent to $4.8 billion USD in 2010 – the third fastest segment of the semiconductor industry – more than doubling from 2009 levels to $7 billion USD by 2014.


4. What are your expectations from the IESA Vision Summit 2011?

The IESA Vision Summit is a prestigious annual gathering providing a platform for all the major players in the Indian semiconductor industry. We are looking forward to work in partnership with the IESA, key players in the semicon eco-system and the government to address issues that are critical to the continued success and growth of the industry and help India be at the forefront of the technological innovations in the electronic industry. Xilinx CEO Moshe Gavrielov will be presenting a keynote address before the gathering and will touch upon the major trends that are influencing the direction of the industry, the company’s plan for the future in India and globally.

About the leader

Vamsi Boppana is the site director and CTO for Xilinx India. As the site director, he oversees all aspects of the office's operations. As the CTO, Boppana leads the PSGV (embedded processing and global verification) and ADVS (building and validating system platforms) divisions in the office. He began his career working in the advanced technology development at Fujitsu Laboratories of America. Before joining Xilinx in 2008, Boppana served as the senior director of technology at Open-Silicon. He was also the co-founder and vice president of engineering at Zenasis Technologies. In addition, Boppana has authored and co-authored over 40 technical papers and has six granted patents. Boppana is a graduate of IIT Kharagpur with a B.Tech (Hons) in Computer Science and Engineering. He also has a MS and PhD from the University of Illinois at Urbana-Champaign.