IESA Delegation to Fukuoka, Japan : Nov 11-13, 2009  


 

IESA delegation to Fukuoka, Japan
MAP 2009: The 9th International Workshop on Microelectronics Assembling and Packaging
November 11 to 13, 2009

Presentation:

Kuttappa Birriananda Wipro
N Krishnan STPI
Poornima Shenoy IESA

Dear Member,
 

We are pleased to inform you that India Semiconductor Association IESA in collaboration with Japan External Trade Organization JETRO, is taking a business delegation to Fukuoka Japan on November 11-13, 2009.

The objective of the visit is to promote Indian Embedded, Automotive and Design companies by bringing together business leaders, Government officials and policy makers to discuss the opportunities that exist between the two countries. We have requestedMr.N.Krishnan, Director General, STPI to lead the delegation.

Event

The aim of the MAP workshop is to facilitate the creation of a value network by linking over 700 IC affiliated companies through open discussion and sharing of state-of-art ideas, techniques and perspectives on microelectronics assembling and packaging among leading industrial companies and academia. The workshop will consist of invited and contributed presentations, exhibition show, poster session, public and private business meetings. The official language is English.

The format is of a limited group with poster sessions and one-on-one business meetings alongside the main conference. Last year around 300 managers and engineers participated at MAP 2008.

The main topics of MAP2009 will be three dimensional packaging (SiP) and electronic components with built-in printed circuit board, eco device (power device, solar cell, LED), MEMS, and sensor device.

More details will be available by mid September 2009.
 

Website

http://www.astsa.jp 
http://map-and-rts.com/blog1/

Benefits

  • Key business meetings with industry and government representatives
  • Explore newer markets
  • Visibility through poster session, networking meetings and company visits

Who should attend?

Companies

  • System
  • Embedded software and services
  • Automotive
  • Design services
  • ATMP


The delegation plan would be discussed with confirmed participants. It would include participation in the conference and the poster session, facilitated networking meetings and industrial visits.

To defray a part of the expenses such as creation of delegate collaterals, related expenses, etc. incurred in connection with organizing the visit, a delegation fee of Rs. 20,000/- (Cheque/ DD in favor of "India Electronics & Semiconductor Association IESA, Bangalore